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Spectra-Mat’s unique technology to infiltrate copper

By starting with a homogenous sintered tungsten matrix, our infiltration guarantees the homogeneity of mechanical and material properties along all three axes. CTE and thermal conductivity remain uniform in X-Y-Z. Our fine machining capabilities and dedicated plating line assure consistency across lots, in final parts of any shape.

  • Exceptional flatness and dimensional tolerance control.
  • Superior thermal conductivity compared to competitive technologies.
  • Excellent CTE stability from RT to 400°C.
  • Consistent, unparalleled plating quality.
Application Semiconductor Spectra-Mat Solution CTE (ppm @ 25C) Thermal Conductivity W/(k2m)
IR Power Semiconductor Laser GaAs W/Cu 90/10 spacers 6.2 201
UV Semiconductor Laser GaN W/Cu 92/8 spacer 5.8 188
HB LEDs GaN W/Cu 92/8 wafer 5.8 188
RF Amplifiers GaAs W/Cu 90/10 Base 6.2 201
Aerospace RF Amplifiers GaAs Mo/Cu 85/15 Base 6.8 154
MW Amplifiers GaN W/Cu 92/8 Base 5.8 188
At 25 C, CTE of GaAs is 6.5 ppm/K and of GaN is 3.2 ppm/k.

Solutions for High Power Semiconductor Lasers:

The superior thermal conductivity of Spectra-mat’s spacers enables the management of the highest level of power of semiconductor lasers.

Solutions for Optical Benches:

The brazing capabilities of tungsten copper to ceramics enable the manufacturing of optical benches where high power semiconductor lasers are couples to lenses and other optical components.

Solutions for HB LEDs:

In the latest generation of HB LEDs, the reduction of production costs can be achieved by employing wafer level packaging, therefore tungsten copper plated wafers (from 2″ to 6′) are the enabling solutions to guarantee an efficient thermal management at reasonable production costs

Solutions for fiber lasers:

A fiber laser combiner withstands a high thermal load, and tungsten copper provides excellent expansion matching and quick heat transfer.

Solutions for RF and MW amplifiers (MMICs):

GaN and GaAs amplifiers are expanding the realm of their applications. Tungsten copper and moly copper flat bases, flanges and machined bases with pockets and pass-through guarantee a continuous flow of heat out of the amplifiers.