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Spectra-Mat’s unique technology to infiltrate copper

in an highly homogeneous sintered tungsten matrix guarantees the homogeneity of thermal conductivity of the tungsten copper material along the three axes. The CTE of tungsten copper is stable from room temperature to over the melting temperature of solders. The fine machining capabilities and the dedicated plating line assure consistency and homogeneity of final parts
in any shapes.

  • Exceptional flatness and dimensional tolerance control.
  • Superior thermal conductivity compared to competitive technologies.
  • Excellent CTE stability till over 400C.
  • Consistent plating quality even on narrow features.

Spectra-Mat's unique technology to infiltrate copper

in an highly homogeneous sintered tungsten matrix guarantees the homogeneity of thermal conductivity of the tungsten copper material along the three axes. The CTE of tungsten copper is stable from room temperature to over the melting temperature of solders. The fine machining capabilities and the dedicated plating line assure consistency and homogeneity of final parts in any shapes.

  • Exceptional flatness and dimensional tolerance control.
  • Superior thermal conductivity compared to competitive technologies.
  • Excellent CTE stability till over 400C.
  • Consistent plating quality even on narrow features.
Application Semiconductor Spectra-Mat Solution CTE (ppm @ 25C) Thermal Conductivity W/(k2m)
IR Power Semiconductor Laser GaAs W/Cu 90/10 spacers 6.2 201
UV Semiconductor Laser GaN W/Cu 92/8 spacer 5.8 188
HB LEDs GaN W/Cu 92/8 wafer 5.8 188
RF Amplifiers GaAs W/Cu 90/10 Base 6.2 201
Aerospace RF Amplifiers GaAs Mo/Cu 85/15 Base 6.8 154
MW Amplifiers GaN W/Cu 92/8 Base 5.8 188
At 25 C, CTE of GaAs is 6.5 ppm/K and of GaN is 3.2 ppm/k.

 

The requirements for more powerful semiconductor lasers

The requirements for more powerful semiconductor lasers both in pulsed and CW mode challenge the ability of traditional thermal management materials to quickly and efficiently dissipate heat. Contrary to injection molding technology, Spectra-Mat’s unique technology to infiltrate copper in an highly homogeneous sintered tungsten matrix guarantees the homogeneity of thermal conductivity of the tungsten copper submounts along the three axes, a very important requirement for multi diodes lasers bars. The superior homogeneity of Spectra-Mat’s tungsten copper material keeps the CTE stable from room temperature to over the soldering temperatures of the laser bars.

  • Flatness: 0.3 μm/mm.
  • Edge radius better than 15 μm.
  • Dimensional tolerances: ±10 μm.
  • Surface roughness: as low as 0.03 μm Ra.
  • AuSn layers with different compositions and thickness.
W weight CTE Thermal conductivity
W 90% Cu 10% 6.2 ppm/K @ 25C 201 W/(m*K)
W 85% Cu 15% 6.8 ppm/K @ 25C 210 W/(m*K)
W 80% Cu 20% 7.4 ppm/K @ 25C 219 W/(m*K)
W 75% Cu 25% 8.0 ppm/K @ 25C 228 W/(m*K)
At 25 C, CTE of GaAs is 6.5 ppm/K and of GaN is 3.2 ppm/k.